The relationship between the rib spacing and the highest chip junction temperature for different rib lengths: optimization of rib thickness. The thickness of the rib affects the heat dissipation efficiency of the rib. Under the condition that the rib spacing is constant, the thickness of the rib can also affect the number of ribs, so the thickness of the rib must be optimized. Optimized for the case of 9W dissipated power. It can be seen that as the thickness of the ribs increases, the minimum capillary limit at all rib thicknesses satisfies the requirement of a dissipative power of 9 W, and the minimum capillary limit first decreases and then increases. It can be seen that as the thickness of the rib increases, the highest junction temperature of the chip also appears to decrease first and then increase. When combined, according to the principle that the lower the junction temperature and the better the heat dissipation effect, the optimum rib thickness is optimized to be 0.3 mm.
Relationship between rib thickness and minimum capillary limitFig.8 Relationship between rib thickness and highest chip junction temperature After optimization of basic parameters, the relationship between chip junction temperature and ambient temperature is optimized by the above factors for each influencing factor, and the power dissipation is 9W. LED luminaires already have good heat dissipation performance, and the junction temperature of the chip is controlled between 38.1 and 76.8 °C, which fully meets the requirements of design specifications. The ambient temperature is related to the junction temperature of the chip. The thermal module is simulated by ICEPAK thermal software, and the junction temperature of the LED chip is 20 °C. ICEPAK Thermal Software Simulation Results Figure 2 summarizes the high-power LED heat pipe heatsink designed in this paper, which greatly improves the heat dissipation performance of high-power LEDs, and after modular design, realizes the best heat dissipation effect. Combined and flexible installation for different functions and applications. The idea of ​​modularity in the practical application of high-power LEDs, whether it is in the early installation or post-maintenance upgrades have shown its superiority, will become an important trend in the development of high-power LED.
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